Табл. 1.12
| Сокращение | Расшифровка |
|---|---|
| ASIC | Application Specific Integrated Circuit |
| AWG | American Wire Gauge |
| BGA | Ball Grid Array |
| BQFP | Bumpered Quad Flat Pack |
| BV | Breakdown Voltage |
| CAD | Computer Aided Design |
| CBGA | Ceramic Ball Grid Array |
| CM | Contract Manufacturing or Contract Manufacturer |
| CMOS | Complementary Metal Oxide Semiconductor |
| COB | Chip-On-Board |
| COG | Chip-On-Glass |
| COTS | Commercial Off The Shelf |
| CPLD | Complex Programmable Logic Device |
| CSP | Chip Scale Package |
| CTE | Coefficient of Thermal Expansion |
| DFM | Design For Manufacturability |
| DFN | Dual Flat No-lead |
| DIP | Dual In-line Package |
| DRAM | Dynamic Random Access Memory |
| DWV | Dielectric Withstanding Voltage |
| ECC | Error Correction Code |
| ECL | Emitter-Coupled Logic |
| EDA | Electronic Design Automation |
| EEPLD | Electrically Erasable Programmable Logic Device |
| EMC | Electromagnetic Compatibility |
| EMI | Electromagnetic Interference |
| EMS | Electronic Manufacturing Services |
| EOL | End Of Life |
| EPLD | Erasable Programmable Logic Device |
| ESD | Electrostatic Discharge |
| ESR | Equivalent Series Resistance |
| ESL | Equivalent Series Inductance |
| FBGA | Fine-pitch Ball Grid Array |
| FC | Flip Chip |
| FCOB | Flip Chip On Board |
| FCOC | Flip Chip On Ceramic |
| FET | Field Effect Transistor |
| FMEA | Failure Mode Effect Analysis |
| FPGA | Field Programmable Gate Array |
| FPT | Fine Pitch Technology |
| FRACAS | Failure Reporting, Analysis and Corrective Action System |
| GAL | Generic Array Logic |
| HALT | Highly Accelerated Life Test |
| HASS | Highly Accelerated Stress Screening |
| HAST | Highly Accelerated Stress Test |
| HBM | Human Body Model |
| HSOP | Small Outline Package with a Heat Sink |
| I/O | Input/Output |
| IC | Integrate Circuit |
| ICT | In-Circuit Test |
| IGBT | Integrated Gate Bipolar Transistor |
| IP | Intellectual Property |
| IR | Infrared |
| LCCC | Leadless Ceramic Chip Carrier |
| LCD | Liquid-Crystal Display |
| LIF | Low Insertion Force |
| LPCC | Leadless Plastic Chip Carrier |
| LSI | Large Scale Integration |
| LTB | Last Time Buy |
| LTS | Last Time Shipment |
| LVT | Low Voltage (BiCMOS) Technology |
| MELF | Metal Electrode Leadless Face |
| MEMS | MicroElectroMechanical Systems |
| MLC | Multi-Level Cell |
| MLCC | Multilayer Ceramic Capacitor |
| MOS | Metal Oxide Semiconductor |
| MOSFET | Metal Oxide Semiconductor Field Effect Transistor |
| MSD | Moisture Sensitive Diode |
| MSL | Moisture Sensitivity Level |
| MTBF | Mean Time Between Failures |
| MTTF | Mean Time to Failure |
| NEMI | National Electronics Manufacturing Initiative |
| NEDA | National Electronic Distributors Association |
| IDEA | Independent Distributors of Electronic Association |
| NRE | Non-Recurring Engineering |
| OEM | Original Equipment Manufacturer |
| OLED | Organic Light Emitting Diodes |
| PAL | Programmable Array Logic |
| PBGA | Plastic Ball Grid Array |
| PCA | Printed Circuit Assembly |
| PCB | Printed Circuit Board |
| PCN | Product Change Notice |
| PDN | Product Discontinuance Notice |
| PGA | Pin Grid Array |
| PLCC | Plastic Leaded Chip Carrier |
| PoP | Package on Package |
| PPM | Parts Per Million |
| PQFN | Power Quad Flat pack No-lead |
| PQFP | Plastic Quad Flat Pack |
| PWB | Printed Wiring Board |
| QFN | Quad Flat No-lead |
| QFP | Quad Flat Pack |
| QML | Qualified Manufacturer List |
| QPL | Qualified Part List |
| RF | Radio Frequency |
| RFI | Radio Frequency Interference |
| RH | Relative Humidity |
| RMS | Root Mean Square |
| SAC | Tin Silver Copper (SnAgCu) |
| SLC | Single-Level Cell |
| SM | Surface Mount |
| SMD | Surface Mount Device |
| SMT | Surface Mount Technology |
| SOC | System-On-Chip |
| SOIC | Small Outline Integrated Circuit |
| SOP | System-On-Package/Small Outline Package |
| SOWIC | Small Outline Wide Integrated Circuit |
| SRAM | Static Random Access Memory |
| Td | Decomposition Temperature |
| TFBGA | Thin Fine-pitch Ball Grid Array |
| TFT | Thin Film Transistor |
| Tg | Glass Transition Temperature |
| TH | Through Hole |
| TTL | Transistor-Transistor Logic |
| UBGA | Micro Ball Grid Array |
| UV | Ultraviolet |
| VCO | Voltage Controlled Oscillator |
| VLSI | Very Large Scale Integration |
| WLP | Wafer Level Package |
| ZIF | Zero Insertion Force |